| 摘要 |
PURPOSE:To raise the cooling effect of LSI chips by a method wherein the ceramic multilayer wiring substrate and the block are integrally formed in one body in a state that the protruded parts of heat-radiating fins are fitted into the holes of the ceramic multilayer substrate and the semiconductor elements are mounted on the protruded parts. CONSTITUTION:Multilayer wirings 2 are arranged in the ceramics of a ceramic multilayer substrate 1 and holes are bored in parts of the surface of the ceramic multilayer substrate 1, whereon LSI chips 3 are mounted. A block 4 with a good thermal conductivity is provided with protruded parts 7 to fit into the holes of the ceramic multilayer substrate 1 and is integrally formed in one body with fins 8 provided on the back surface thereof, the ceramic multilayer substrate 1 and the block 4 are integrally formed in one body in a state that the protruded parts 7 are fitted into the holes of the ceramic multilayer substrate 1 and the LSI chips 3 are mounted on the protruded parts 7 of the block 4. The heat generated in the LSI chips 3 conducts to the protruded parts 7 with a high thermal conductivity and the block 4 with a good thermal conductivity and is radiated from the fins 8. |
