| 摘要 |
PURPOSE:To reduce the thickness of the packaged module, reduce the package area and increase reliability by forming metallic projections on the prescribed electrode terminals of the IC, LSI semiconductor devices, and mounting and building-in within the card. CONSTITUTION:An electroconductive projections 10 are formed on the surface of semiconductor device 2 and the semiconductor device 2 is embedded in a recessed part 12a provided in a supporting body 12 comprising the card 6. A film 13 is provided on the surface of the supporter 12 and only the conductive projection 10 of the semiconductor device 2 is exposed. The semiconductor device 2 is a semiconductor integrated circuit having memories for CPUs and memory functions. In order to receive/send signals between the embedded semiconductor circuit 2 and the outside circuits, outside signal terminals 11 contact with the electroconductive projection 10. |
