发明名称 THIN-FILM INTEGRATED DEVICE
摘要 <p>An insulating substrate of a thin-film integrated device is provided with thin-film elements, such as a thin-film capacitor, a thin-film field-effect transistor and a thin-film electroluminescence element, which each employ an insulating film (3, 7, 13, 15, 16) as one of the constituent elements thereof. The insulating film is constituted by a sputtered composite oxide film of which tantalum and aluminium are its main components. Since a sputtered composite oxide film has the advantage of a large specific inductivity and dielectric breakdown field strength and a small leakage current, its application to these thin-film elements makes it possible to improve the operating characteristics thereof and improve the overall reliability. </p>
申请公布号 WO1984003992(P1) 申请公布日期 1984.10.11
申请号 JP1984000145 申请日期 1984.03.29
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