| 摘要 |
PURPOSE:To crush mounds on a wafer surface with speed and certainly by a method wherein a mound crushing board is positioned facing a wafer supporting block and the block is caused to travel a prescribed distance toward the board. CONSTITUTION:An Si wafer 10 is mounted on a supporting block 11 and is attracted by a vacuum adsorber 11b to a surface 11a. A mechanism 12 is supplied with compressed air and pushes up the block 11 so the wafer surface abuts against the board 13 supported by a ball joint 14. The board 13 abutting against the entire surface of the wafer 10, mound crushing all over the wafer 10 is ensured. Then, air is bled out of the mechanism 12, air is spouted from a hole 13a to ensure the separation of the wafer 10 from the board 13, and then the block 11 comes down to the original position. Next, the adsorber 11b stops functioning and then the wafer 10 is taken out. For a wafer of different thickness, an adjusting knob 16 is operated to obtain a suitable, constant pressure. This setup results in a rapid, sure, and uniform treatment. |
