发明名称 DEVICE FOR TRANSFER MOLDING
摘要 PURPOSE:To control the implanting pressure of resin as well as to perform a hermetical sealing of resin without damaging an element by a method wherein a pressure detector is installed in such manner that it is exposed at a section on the passage where the resin is pressure-feeded to the cavity on which the element to be formed is inserted. CONSTITUTION:The pressure detector 10 is installed at s section of runner of the device with which a forming and sealing work is performed on electronic parts and the like by pressure-feeding thermo-setting resin. The resin inducted from a pouring hole 3, provided on a lower mold 1 of the device consisting of the lower mold 1 and the upper mold 2, is guided by the runner 4 and pressure-feeded to a cavity 5 wherein the element to be formed is inserted. For example, a cavity 6 is provided at the end section of the runner 4, oil 8 and sensor 9 are filled in an elastic container 7 located under the cavity 6 and the pressure detector 10 is installed in exposed state. No special limitation is given for the mounting location of the detector 10, if it is on the passage of the resin. The pressure of the implanting resin is controlled in accordance with the detected value of pressure. Through these procedures, the resin sealing can be performed at the proper pressure which causes no damage to the connecting wire of the element and the like.
申请公布号 JPS56155538(A) 申请公布日期 1981.12.01
申请号 JP19810023029 申请日期 1981.02.20
申请人 HITACHI LTD 发明人 NISHIDA SUMIO;OKIKAWA SUSUMU;WAKASHIMA YOSHIAKI
分类号 H01L21/56;B29C43/00;B29C45/00;B29C45/02;B29C45/14;B29C45/26;B29C45/76;B29C45/77 主分类号 H01L21/56
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