| 摘要 |
PURPOSE:To enable the enlargement of a semiconductor pellet housed by a mechanism wherein a relaying tube is mounted into an enclosing instrument and wires bonded with an electrode disposed to the pellet are collectively extracted when the pellet is housed in the enclosing instrument and the wires are extracted outisde the enclosing instrument. CONSTITUTION:A semiconductor pellet 1 is fastened onto a base portion 4c of an enclosing instrument through a solder material 3, and an upper body 10 of the enclosing instrument, whose ceiling is provided with an electric insulating member 8, is glued to an edge portion of the base portion 4c by using a flange 9 mounted to the lower end. A semiconductor device is constituted in this way, and a plurality of leads bonded with an electrode of the pellet 1 are penetrated through the member 8 and extracted outside the enclosing instrument, but this method is as follows. That is, a wire 2b connected to the base is penetrated through the member 8 and connected to an extracting terminal 4b, and other wires 12e'-12e''' connected to an emitter are collectively bonded with a side surface of the cylindrical relaying tube 16 in iron, etc. erected onto the base portion 4c through a ceramic plate 5, penetrated through the member 8 and connected to a terminal 4e. |
