| 摘要 |
PURPOSE:To make continuous ion plating possible so as to increase the productivity, by equipping a vacuum vessel therein a mechanism for holding plural piled up substrates to be ion plated, a mechanism for holding substrates having been treated, and mechanisms for conveying the substrates between the two mechanisms described above. CONSTITUTION:A door 10 for carrying substrates into a vacuum vessel 1 is opened, plural masked substrates 23 are set on a substrate-holding mechanism 24A. After the door is closed and the vessel 1 is shut airtightly, the vessel 1 is evacuated. A prescribed voltage is applied to substrate holders 60A, 60B, and to an ion-cleaning electrode 25 etc. so as to clean the surfaces of the substrates 23 by ion bombardment. Thereafter, a conveying mechanism 70 is moved forward two times repeatedly in the direction of an arrow B to convey the most upper substrate 23 to the substrate holders 60B, 60A. Then the substrate 23 is ion plated with a metal vaporized from crucibles 40A, 40B. After completion of the ion plating, the substrate 23 is carried to a substrate-holding mechanism 24B by the conveying mechanism 70. All substrates 23 are ion plated by the repetition of the operation. |
