METHOD FOR TITAN-GERMANIUM CONTACT LAYER CREATION

摘要

FIELD: electronics. ^ SUBSTANCE: invention is attributed to microelectronics and can be used in production of semiconductor devices and integral circuits. Essence of invention: in the method of attaching silicon chip to chip holder, chip seating surface is successively sputtered with two titan-germanium metals, and chip to chip holder soldering is carried out at temperature of 280-300°C. ^ EFFECT: improvement of chip with chip-holder contact reliability and stability of attachment process.