发明名称 Hybrid semiconductor electronic assembly - has coating on one of its sides, serving as stiffening and surface protection, or for heat evacuation
摘要 <p>The assembly has functional components such as inductances, capacitors and resistors, and possibly sandwich type components. There is a laminated base consisting of at least a single layer flexible insulating support, coated on at least one side with a foil coated possibly on both sides with thin layers of plastic or metal. Conducting, connecting and functional components are produced from the individual layers and films, as in 2641310. The electronic assembly has a coating (3) at one of its side serving as stiffening and surface protection, or for heat evacuation.</p>
申请公布号 DE2727828(A1) 申请公布日期 1979.01.18
申请号 DE19772727828 申请日期 1977.06.21
申请人 SIEMENS AG 发明人 MAIWALD,WERNER,DIPL.-PHYS.
分类号 H01L25/16;H05K3/00;H05K3/28;H05K3/38;(IPC1-7):01L49/02 主分类号 H01L25/16
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