FILLED POLYAMIDE MOULDING COMPOSITION

摘要

1. A thermoplastic moulding composition based on linear polyamides, which contains from 5 to 130 parts by weight (based on 100 parts by weight of polyamide) of a silane-modified inorganic filler, from 5 to 500 ppm (based on polyamide) of copper, with or without conventional additives and auxiliaries, characterized in that the filler is an anhydrous aluminium silicate which contains 50 to 56% by weight of SiO2 and 42 to 46% by weight of Al2 O3 , can be obtained by thermal dehydration of kaolin or kaolinite at temperatures of from 800 degrees to 1 100 degrees C, and has a specific surface area of more than 6 m**2 /g, and that the copper was added to the moulding composition in the form of a homogeneous concentrate consisting of polyamide, a salt of monovalent copper, and an alkali or alkaline earth halide.