Build-up printed wiring board substrate having a core layer that is part of a circuit

摘要

Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole.

主权项

1. A printed wiring board substrate, comprising:
a core layer that includes a carbon plate; a layer of metal that is clad by resin to one side of the carbon plate and thereby defines the outer surface of the core layer;
wherein the layer of metal includes an interior surface from which protrusions (dendrites) extend, and a plurality of the protrusions (dendrites) contact the carbon plate; and at least one build-up wiring portion formed on the layer of metal; wherein the build-up portion includes a dielectric layer comprising non-reinforced dielectric formed on the layer of metal; and wherein the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the carbon plate in the core layer via a plated through hole.