| 摘要 |
<p>PURPOSE:To strengthen the close contact between a lead frame and a resin layer by forming an intermediate part of the lead frame into a rough surface. CONSTITUTION:A recessed part 5, where a semiconductor element 2 is housed, is provided on a box package 1, the semiconductor element 2 is fixed to the recessed part 5 using a bonding agent 6, and the semiconductor element 2 and a lead frame 3 are electrically connected by a bonding wire 7. On the box package 1, the intermediate part 11 of the lead frame 3 is buried in the resin 10 in which the intermediate part 11 of the lead frame 3 constitutes a box package 1. The surface of the intermediate part 11 of the lead frame 3 is roughened. By the above-mentioned roughing of surface, the adhesion of the lead frame 11 is strengthened when a hollow package is molded, and durability and moisture proof property can be improved.</p> |
