LAMINATING DAMPING SUBSTRATE AND DAMPING STRUCTURE FORMED BY LAMINATING DAMPING SUBSTRATES

摘要

PROBLEM TO BE SOLVED: To provide a damping structure dispensing with the connection of a resistor used in a conventional damping structure, having a simpler structure and capable of being subjected to various molding processings and to provide a laminating damping substrate constituting the damping structure. SOLUTION: The laminating damping structure is manufactured from a piezoelectric ceramics material or piezoelectric polymeric material and a fiber reinforced plastic (FRP) composition having conductivity and a plurality of the damping substrates are laminated to constitute the first damping structure. Alternatively, the second damping structure is constituted by laminating at least one piezoelectric polymeric film or a piezoelectric ceramics thin film so as to position the same in a multilayered laminate formed by laminating a plurality of laminating FRP substrates having conductivity.