| 主权项 |
1. An offset-printing method for a three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package, comprising the steps of:
1) forming a substrate circuit on a semiconductor wafer, wherein said wafer comprises at least first, second and fourth 3D-oP dice, with said second 3D-oP die adjacent to said first 3D-oP die along the y direction and said fourth 3D-oP die adjacent to said first 3D-oP die along the x direction; 2) a first printing step for transferring a first plurality of mask patterns to a first data-coding layer in said first, second and fourth 3D-oP dice, wherein the origin of said data-mask is initially aligned to the origin of said first die at said first printing step; 3) a second printing step for transferring a second plurality of mask patterns to a second data-coding layer in said first, second and fourth 3D-oP dice, wherein the origin of said data-mask is initially aligned to the origin of said second die at said second printing step; wherein said first and second plurality of mask patterns are from a same data-mask; and said first and fourth 3D-oP dice are vertically stacked in said 3-D package. |
