| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which reattachment of a semiconductor package is easy after detaching the semiconductor package from a circuit board.SOLUTION: A semiconductor device comprises: a circuit board; a semiconductor package; a solder bonding part electrically connecting the circuit board and the semiconductor package; and a plate-like member arranged between the circuit board and the semiconductor package and having a hole through which the solder bonding part passes, in which the hole is formed such that the narrowest part of the hole is thinner than the solder bonding part arranged on the semiconductor package side. |
