发明名称 切削装置
摘要 PROBLEM TO BE SOLVED: To provide a cutting device capable of restraining cutting liquid from dripping in an imaging range on a surface of a workpiece.SOLUTION: The cutting device comprises: a chuck table 10 for holding a workpiece W; processing means having a cutting blade for cutting the workpiece W and a nozzle for supplying cutting liquid to the cutting blade; and imaging means 30 for imaging the surface of the workpiece W. The imaging means 30 comprises: a microscope 31 having an objective lens 31a opposed to the surface of the workpiece W held by the chuck table 10; a microscope box 31 covering a periphery of the microscope 31 and having a bottom part 32a on one part of which an imaging opening 32b is formed; and shutter means 33 for selectively opening/closing the imaging opening 32b during shielding and imaging. The bottom part 32a of the microscope box 32 is inclined to a horizontal plane, and the cutting liquid adhered to the bottom part 32a is introduced to a lower end 32d of the inclined bottom part 32a and is not remained on the bottom part 32a, so as to promote dripping.
申请公布号 JP5955530(B2) 申请公布日期 2016.07.20
申请号 JP20110241682 申请日期 2011.11.02
申请人 株式会社ディスコ 发明人 前杢 芳雄;小野 隆之
分类号 H01L21/301;B24B49/12 主分类号 H01L21/301
代理机构 代理人
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