| 发明名称 |
SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING |
| 摘要 |
A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package. |
| 申请公布号 |
US2015331014(A1) |
申请公布日期 |
2015.11.19 |
| 申请号 |
US201414276223 |
申请日期 |
2014.05.13 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Audette David M.;Bronson, JR. Dennis M.;Comeau Joseph K. V.;Fregeau Dustin M.;Gardell David L.;Roy, III Frederick H.;Salimeno, III James R.;Sullivan Timothy D. |
| 分类号 |
G01R1/073;G01R31/28 |
主分类号 |
G01R1/073 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A probe tip structure for a test application of solder on a ball grid array package, the probe tip structure comprising:
an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer has a melting point higher than a melting point of the inner core. |
| 地址 |
Armonk NY US |
