| 摘要 |
PROBLEM TO BE SOLVED: To prevent a copper through-hole from being oxidized, and make proper the fitting between the copper through-hole and solder. SOLUTION: A part-mounting section 400 of a printed-circuit board 300 is structured, such that it has a copper through-hole 3 and a coating layer 8 applied to surfaces 4a and 5a of lands 4 and 5 of the copper through-hole 3, which is melted through heat treatment and is bonded onto the surfaces 4a and 5a of the lands 4 and 5 and the inner peripheral surface 3a of the copper through-hole 3; wherein since the coating layer 8 is formed on the surfaces 4a and 5a of the lands 4 and 5 and on the inner peripheral surface 3a of the copper through-hole 3, oxidation of the copper through-hole 3 can be prevented by the coating layer 8, and fitting of the copper through-hole 3 and the solder 200 can be made satisfactory. COPYRIGHT: (C)2009,JPO&INPIT
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