发明名称 |
Thermoplastic resin composition, production method of thermoplastic resin composition, molding material, and light-emitting body |
摘要 |
Disclosed is a production method of a thermoplastic resin composition comprising: blending a thermoplastic resin (A) and a metal complex (B) and a ligand (C2), wherein the metal complex (B) has a ligand (C1) coordinated therein, and wherein the ligand (C2) has a higher boiling point than the ligand (C1) under atmospheric pressure, and then heating and mixing the resulting blend at a temperature of not less than a boiling point of the ligand (C1) and not more than a boiling point of the ligand (C2), to produce a thermoplastic resin composition that can provide a light-emitting body at low cost in which a light-emitting material is dispersed in the resin in a good dispersion state, excellent in transparency and excellent in light-emitting properties of visible light; a molding material obtained by molding the thermoplastic resin composition; and a light-emitting body obtained by molding the thermoplastic resin composition. |
申请公布号 |
US9090820(B2) |
申请公布日期 |
2015.07.28 |
申请号 |
US201113990192 |
申请日期 |
2011.11.28 |
申请人 |
Mitsubishi Rayon Co., Ltd. |
发明人 |
Niino Hiroshi;Aoki Yutaka |
分类号 |
C09K11/06;C08J3/20;C08K5/00;C08K5/56;C08L101/00 |
主分类号 |
C09K11/06 |
代理机构 |
Morgan, Lewis & Bockius LLP |
代理人 |
Morgan, Lewis & Bockius LLP |
主权项 |
1. A production method of a thermoplastic resin composition,
blending a thermoplastic resin (A) and a metal complex (B) and a ligand (C2), wherein the metal complex (B) has a ligand (C1) coordinated therein, and wherein the ligand (C2) has a higher boiling point than the ligand (C1) under atmospheric pressure, and then heating and mixing the resulting blend at a temperature of not less than the boiling point of the ligand (C1) and not more than the boiling point of the ligand (C2). |
地址 |
Tokyo JP |