发明名称 Thermoplastic resin composition, production method of thermoplastic resin composition, molding material, and light-emitting body
摘要 Disclosed is a production method of a thermoplastic resin composition comprising: blending a thermoplastic resin (A) and a metal complex (B) and a ligand (C2), wherein the metal complex (B) has a ligand (C1) coordinated therein, and wherein the ligand (C2) has a higher boiling point than the ligand (C1) under atmospheric pressure, and then heating and mixing the resulting blend at a temperature of not less than a boiling point of the ligand (C1) and not more than a boiling point of the ligand (C2), to produce a thermoplastic resin composition that can provide a light-emitting body at low cost in which a light-emitting material is dispersed in the resin in a good dispersion state, excellent in transparency and excellent in light-emitting properties of visible light; a molding material obtained by molding the thermoplastic resin composition; and a light-emitting body obtained by molding the thermoplastic resin composition.
申请公布号 US9090820(B2) 申请公布日期 2015.07.28
申请号 US201113990192 申请日期 2011.11.28
申请人 Mitsubishi Rayon Co., Ltd. 发明人 Niino Hiroshi;Aoki Yutaka
分类号 C09K11/06;C08J3/20;C08K5/00;C08K5/56;C08L101/00 主分类号 C09K11/06
代理机构 Morgan, Lewis & Bockius LLP 代理人 Morgan, Lewis & Bockius LLP
主权项 1. A production method of a thermoplastic resin composition, blending a thermoplastic resin (A) and a metal complex (B) and a ligand (C2), wherein the metal complex (B) has a ligand (C1) coordinated therein, and wherein the ligand (C2) has a higher boiling point than the ligand (C1) under atmospheric pressure, and then heating and mixing the resulting blend at a temperature of not less than the boiling point of the ligand (C1) and not more than the boiling point of the ligand (C2).
地址 Tokyo JP