Manufacturing method of carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and double-side polishing method of wafer

摘要

A manufacturing method of a carrier for a double-side polishing apparatus for polishing surfaces of a wafer, the carrier having: a carrier body arranged between upper and lower turn tables, the carrier body having a holding hole for holding the wafer; and a ring-shaped resin insert arranged along an inner circumference of the holding hole, the resin insert having an inner circumferential surface to be brought into contact with a peripheral portion of the wafer to be held, the method having the steps of attaching, to the holding hole of the carrier body, a base material for the resin insert not having the inner circumferential surface to be brought into contact with the wafer to be held, and performing inner-circumferential-surface-forming processing on the base material for the resin insert to form the inner circumferential surface to be brought into contact with the peripheral portion of the wafer to be held.

主权项

1. A manufacturing method of a carrier for a double-side polishing apparatus for polishing both surfaces of a wafer,
the carrier comprising:
a carrier body configured to be arranged between upper and lower turn tables that each have a polishing pad attached thereto;a holding hole disposed in the carrier body and configured to hold the wafer such that the wafer is sandwiched between the upper and lower turn tables during polishing of the wafer; anda ring-shaped resin insert arranged along an inner circumference of the holding hole, the resin insert having an inner circumferential surface configured to be brought into contact with a peripheral portion of the wafer during polishing of the wafer, the method comprising the steps of:
attaching a base material to the holding hole, the base material comprised of the resin insert before formation of the inner circumferential surface such that the base material has either (i) a ring shape with an inner diameter smaller than a diameter of the wafer or (ii) a disklike shape; andafter the attaching step, performing inner-circumferential-surface-forming processing on the base material to form the inner circumferential surface on the resin insert.