METHOD FOR FORMING METAL WIRING LAYER, DEVICE FOR FORMING METAL WIRING LAYER, AND STORAGE MEDIUM

摘要

[Problem] To allow formation of a metal wiring layer inside a recessed part of a substrate without the metal wiring layer inside the recessed part being formed outward of the recessed part. [Solution] A method for forming a metal wiring layer provided with a step for forming a catalyst layer (5) composed of Pd on a tungsten layer (W) disposed on the bottom surface (3a) of a recessed part (3) of a substrate (2) without formation of the catalyst layer (5) on the surface (3b) of an insulating layer of the recessed part(3), and a step for forming an Ni-based metal wiring layer (7) on the catalyst layer (5) of the recessed part (3).