| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal-clad laminated plate for an interposer which can suppress the warpage of a semiconductor package both at a normal temperature and during heating, and provide the semiconductor package using the same. <P>SOLUTION: A metal-clad laminated plate is used for an interposer of a semiconductor package with one side sealed includes at least an insulating resin layer containing a glass cloth of a base material and a metal foil provided on the outermost surface. The insulating resin in the insulating resin layer contains a thermosetting resin and an inorganic filler as essential components. The glass transition temperature by a DMA method of the insulating resin is 240 to 310°C, and the flexural modulus of a portion except the metal foil at 250°C is 10 GPa or more. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
