发明名称 |
METHOD OF FORMING STRAIN-RELAXED BUFFER LAYERS |
摘要 |
Implementations described herein generally relate to methods for relaxing strain in thin semiconductor films grown on another semiconductor substrate that has a different lattice constant. Strain relaxation typically involves forming a strain relaxed buffer layer on the semiconductor substrate for further growth of another semiconductor material on top. Whereas conventionally formed buffer layers are often thick, rough and/or defective, the strain relaxed buffer layers formed using the implementations described herein demonstrate improved surface morphology with minimal defects. |
申请公布号 |
US2015079803(A1) |
申请公布日期 |
2015.03.19 |
申请号 |
US201414465330 |
申请日期 |
2014.08.21 |
申请人 |
Applied Materials, Inc. |
发明人 |
HUANG Yi-Chiau;KIM Yihwan |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method of heteroepitaxial deposition of a strain relaxed buffer (SRB) layer on a substrate, comprising:
epitaxially depositing a buffer layer on a substrate; epitaxially depositing a silicon containing capping layer on the buffer layer; and annealing the buffer layer and silicon containing capping layer to relax the buffer layer. |
地址 |
Santa Clara CA US |