发明名称 METHOD OF FORMING STRAIN-RELAXED BUFFER LAYERS
摘要 Implementations described herein generally relate to methods for relaxing strain in thin semiconductor films grown on another semiconductor substrate that has a different lattice constant. Strain relaxation typically involves forming a strain relaxed buffer layer on the semiconductor substrate for further growth of another semiconductor material on top. Whereas conventionally formed buffer layers are often thick, rough and/or defective, the strain relaxed buffer layers formed using the implementations described herein demonstrate improved surface morphology with minimal defects.
申请公布号 US2015079803(A1) 申请公布日期 2015.03.19
申请号 US201414465330 申请日期 2014.08.21
申请人 Applied Materials, Inc. 发明人 HUANG Yi-Chiau;KIM Yihwan
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of heteroepitaxial deposition of a strain relaxed buffer (SRB) layer on a substrate, comprising: epitaxially depositing a buffer layer on a substrate; epitaxially depositing a silicon containing capping layer on the buffer layer; and annealing the buffer layer and silicon containing capping layer to relax the buffer layer.
地址 Santa Clara CA US
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