| 摘要 |
AN IMPLANTABLE MEDICAL DEVICE (IMD) IS DISCLOSED. THE IMD INCLUDES A FIRST SUBSTRATE (300A) HAVING A FRONT SIDE (302A) AND A BACKSIDE (302B). A FIRST VIA IS FORMED IN THE FRONT SIDE, THE VIA EXTENDING FROM A BOTTOM POINT IN THE FRONT SIDE TO A FIRST HEIGHT LOCATED AT A SURFACE OF THE FRONT SIDE. A FIRST CONDUCTIVE PAD IS FORMED IN THE FIRST VIA, THE FIRST CONDUCTIVE PAD HAVING AN EXPOSED TOP SURFACE LOWER THAN FIRST HEIGHT. A SECOND SUBSTRATE (300B) IS COUPLED TO THE FIRST SUBSTRATE (300A), THE SECOND SUBSTRATE HAVING A SECOND VIA FORMED IN THE FRONT SIDE, THE VIA EXTENDING FROM A BOTTOM POINT IN THE FRONT SIDE TO A SECOND HEIGHT LOCATED AT A SURFACE OF THE FRONT SIDE. A SECOND CONDUCTIVE PAD IS FORMED IN THE SECOND VIA, THE SECOND CONDUCTIVE PAD HAVING AN EXPOSED TOP SURFACE LOWER THAN SECOND HEIGHT. THE COUPLED SUBSTRATES ARE HEATED UNTIL A PORTION OF ONE OR BOTH CONDUCTIVE PADS REFLOW, DEWET, AGGLOMERATE, AND MERGE TO FORM AN INTERCONNECT (340B), HERMETIC SEAL, OR BOTH DEPENDING ON THE REQUIREMENTS OF THE DEVICE. (FIG.1) |
