| 摘要 |
<p>PURPOSE: A method of manufacture of metalized plastic 3D circuit is provided to form a 3D circuit pattern on a 3D plastic body directly without additional circuit carrier and satisfy the demand about minimized and compact electronic devices. CONSTITUTION: A method of manufacture of 'metalized plastic 3D circuit' comprises: (i) a step of providing a 3D structural plastic body; (ii) a step of performing the preprocessing on the surface of the plastic body; (iii) a step of performing the metallization process on the preprocessed surface of the above plastic body; (iv) a step of performing the photoresist coating process on the surface of the thin metallic film; (v) a step of performing the exposure to the photoresist protective film and the developing process; (vi) a step of performing the etching process on 'the thin metallic film which is not covered with the patterned photoresist protective film'; (vii) a step of performing the stripping process; and (viii) a step of performing the surface process on the surface of the patterned metallic circuit film. [Reference numerals] (AA) Provide a 3D structural plastic body; (BB) Perform a preprocessing step on the surface of the plastic body; (CC) Perform a metallization process on the preprocessed surface of the plastic body; (DD) Perform a photoresist coating process on the surface of the thin metallic film to produce a photoresist protective film; (EE) Perform an exposure process and a developing process on the photoresist protective film to form a patterned photoresist protective film; (FF) Perform an etching process on the thin metallic film which is not covered with the patterned photoresist protective film to form a patterned metallic circuit film under the patterned photoresist protective film; (GG) Perform a stripping process to remove the patterned photoresist protective film from the patterned metallic circuit film; (HH) Perform a surface preprocess on the surface of the patterned metallic circuit film to form a metallic protective film</p> |
