发明名称 RESIN MOLDING MOLD, RESIN MOLDING DEVICE, RESIN MOLDING METHOD, AND RESIN MOLDING MOLD EVALUATION METHOD
摘要 <p>The present invention addresses the problem of providing a resin molding mold capable of improved resin filling. The solution is a resin molding mold (10) wherein a communicating path that connects a pot (13), a cull (14), a runner gate (15), a forming cavity (16), a through gate (17), a dummy cavity (18), and an air vent (19) is formed by closing an upper die (11) with a lower die, and resin (R) that has been force-fed from the pot (13) and filled in the forming cavity (16) is heat-cured. Here, the resin molding mold (10) is provided with: a plate-shaped middle mold (20), which is clamped between the upper die (11) and the lower die (12); an air suction mechanism (50) provided so as to communicate with the air vent (19); and a movable pin (53) provided so as to be capable of moving back and forth in the middle section of the air vent (19).</p>
申请公布号 WO2014136509(A1) 申请公布日期 2014.09.12
申请号 WO2014JP52227 申请日期 2014.01.31
申请人 APIC YAMADA CORPORATION 发明人 KAWAGUCHI, MAKOTO;WAKUI, MASAAKI
分类号 B29C45/34;B29C45/02;B29C45/26;H01L21/56 主分类号 B29C45/34
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