Temperature Equalization Apparatus Jetting Fluid for Thermal Conduction Used in Electrical Equipment

摘要

The present invention discloses an external thermal conduction interface structure of electrical equipment wherein a fluid jetting device is utilized to jet a thermal conductive fluid for exchanging heat with the external thermal conduction interface structure of electrical equipment via the thermal energy of the jetted thermal conductive fluid, the heat exchange means includes the external thermal conduction interface structure of electrical equipment having relative high temperature being cooled by a fluid have relative lower temperature, and external thermal conduction interface structure of electrical equipment having relative lower temperature being heated by a fluid having relative higher temperature.

主权项

1. A temperature equalization apparatus, comprising:
at least one fluid jetting device (103) for jetting a thermally conductive fluid (104) by directing a jet of the thermally conductive fluid (104) at an external thermal conduction interface structure (101) of an electrical equipment (100), said thermally conductive fluid exchanging heat with the thermal conduction interface structure to conduct heat away from the electrical equipment (100); a fluid collecting basin (105) for collecting the thermal conductive fluid (104) after it has exchanged heat with the thermal conduction interface structure (101); means for returning said fluid from said fluid collecting basin (105) to the fluid jetting device (103), thereby circulating the thermal conductive fluid (104) between the jetting device (103), the thermal conduction interface structure (101), and the fluid collecting basin (105); and a temperature equalizing device (102) installed in a natural thermal energy body (200) and connected to the fluid connecting basin (105) by a pipeline (108), said pipeline (108) supplying said thermal conducting fluid (104) from the fluid collecting basin (105) to the temperature equalizing device (102), wherein thermal energy acquired by the thermal conductive fluid (104) from the external thermal conduction interface structure (101) is dissipated in said natural thermal energy body (200) via said temperature equalizing device (102).