DICING TAPE INTEGRATED SEMICONDUCTOR REAR FACE FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a dicing tape integrated semiconductor rear face film that can provide a good dicing property and prevent burr from being generated in a semiconductor chip obtained by dicing of a semiconductor wafer, and thereby, enables to manufacture a semiconductor device with high reliability while improving a manufacturing yield.SOLUTION: A dicing tape integrated semiconductor rear face film has: a dicing tape in which a base material and an adhesive layer are laminated in this order; and a semiconductor rear face film laminated on the adhesive layer of the dicing tape. A thickness of the adhesive layer is equal to or more than 20 μm and equal to or less than 40 μm.