发明名称
摘要 PROBLEM TO BE SOLVED: To provide a heat tool with which a temperature on a pressurizing surface of a heating element can be uniformed over a full length. SOLUTION: A heat tool with which a plurality of first elements to be bonded and a plurality of second elements to be bonded are overlapped and collectively soldered, comprises a heating element which generates heat through electrification and a holder supporting the heating element. The heating element has an elongated pressurizing surface which faces the first and second elements to be bonded and extends in an arraying direction of the first and second elements to be bonded. The holder includes a pair of supporting sections which extend in a length direction of the heating element, hold the heating element therebetween from a direction orthogonal to a length direction of the pressurizing surface and are electrically connected to the heating element, and a current supply section which is provided in a terminal portion of each of the supporting sections in the length direction thereof and has a heat capacitance greater than that of the supporting sections. A heat radiating section to which a cooling medium is blown is provided in an outer peripheral portion of the current supply section. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5487142(B2) 申请公布日期 2014.05.07
申请号 JP20110039909 申请日期 2011.02.25
申请人 发明人
分类号 H01L21/60;B23K1/00;B23K3/04;B23K101/42;H01L21/603;H05K3/34 主分类号 H01L21/60
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