| 摘要 |
A light emitting device package according to an embodiment comprises: a lead frame; a conductive element located on the lead frame; and a light emitting chip separated from the lead frame and coupled with the conductive element, wherein a resin composition is filled between the light emitting chip and the lead frame. The light emitting chip includes: a translucency substrate; a light emitting structure located on the translucency substrate; an element pad located on the light emitting structure; a metal protrusion located on the element pad; and an isolating substrate covering the element pad and the metal protrusion, wherein the isolating substrate comprises a stepped pulley on the internal light emitting structure. |
