发明名称 |
POLISHING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE EMPLOYING THIS POLISHING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURED BY THIS METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaft 11 of a polishing pad 13 and a rotating shaft 31 of a dresser 30 and shape change of the polishing pad 13 based on input of a target shape of the polishing pad 13 and alternating repetition of dressing the polishing pad 13 by the dresser 30 and measurement of shape of the polishing pad 13 by a pad shape measurement instrument 20 is acquired at a stage prior to commencement of a series of polishing steps for continuously polishing a plurality of polishing target objects (semiconductor wafer W) by a polishing tool 10, the polishing pad 13 is machined to the target shape 13 while the dressing position P is controlled, whereby the dressing position P is set during the polishing steps on the basis of a processing result of this data.
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申请公布号 |
US2013183886(A1) |
申请公布日期 |
2013.07.18 |
申请号 |
US201313786122 |
申请日期 |
2013.03.05 |
申请人 |
NIKON CORPORATION;NIKON CORPORATION |
发明人 |
TANAKA TOSHIHISA;TANAKA ATSUSHI;KITADE YUKO |
分类号 |
B24B49/00;B24B49/12;B24B53/017 |
主分类号 |
B24B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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