| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate cleaning chamber, chamber components, and a substrate cleaning method. <P>SOLUTION: A substrate cleaning chamber includes a contoured ceiling electrode having an arcuate surface that faces a substrate support and has a variable cross-sectional thickness to vary the gap size between the arcuate surface and the substrate support to provide a varying plasma density across the substrate support. A dielectric ring for the cleaning chamber comprises a base, a ridge, and a radially inward ledge that covers the peripheral lip of the substrate support. A base shield comprises a circular disc having at least one perimeter wall. Cleaning and conditioning processes for the cleaning chamber are also described. <P>COPYRIGHT: (C)2012,JPO&INPIT |
