发明名称 |
Substrate Dicing Method by Nano Void Array Formation using Femtosecond Pulse Lasers |
摘要 |
PURPOSE: A method for cutting for nano-void array forming by femtosecond laser is provided to improve the cutting and processing efficiency of a transparent material by forming nano-void array using femtosecond laser. CONSTITUTION: A method for cutting for nano-void array forming by femtosecond laser comprises next steps. A pole first grade femtosecond laser is condensed to a condensing lens(120) and radiates laser beam to a transparent material or substrate. The plasma defocusing is performed by multi-photon ionization. Self focusing is performed due by Kerr Lens. Nano-Void Array(210) is formed on a substrate and cut. The energy per pulse has the energy value on the substrate in order to become over the threshold energy 0.2uJ for the void formation. |
申请公布号 |
KR101181719(B1) |
申请公布日期 |
2012.09.19 |
申请号 |
KR20100059233 |
申请日期 |
2010.06.22 |
申请人 |
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发明人 |
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分类号 |
B23K26/55;C03B33/09;H01L21/304;H01S3/10 |
主分类号 |
B23K26/55 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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