| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for highly productively manufacturing a semiconductive roller without any deflection when polishing a roller main body, wherein the semiconductor roller includes the roller main body having Shore A hardness of 60 or less, a compression set of 10% or less and the surface roughness Rz of the outer peripheral surface of not less than 3.0 μm but not more than 10.0 μm. <P>SOLUTION: A roller body 2 is formed by using a semiconductive rubber composition including a base polymer and not less than 6.6 pts.mass but not more than 30 pts.mass of carbon black with respect to 100 pts.mass of the base polymer, and the carbon black has an average primary particle diameter of not less than 80 nm but not more than 200 nm. The outer peripheral surface 5 of the roller body 2 is polished by a dry type plunge grinding using a grinding wheel 7 that ranges over the entire width of the outer peripheral surface 5. <P>COPYRIGHT: (C)2012,JPO&INPIT |
