| 摘要 |
Provided is: a method of manufacturing a high-quality and high heat-radiation metal-base substrate for having heat-generating electronic parts mounted thereon, wherein voids do not remain in an insulation adhesion layer thereof; and a method of manufacturing a circuit board. A metal-base substrate (14) is made by executing: a dispersing process (S1) for dispersing a disperse phase within a dispersion medium of an insulation adhesive containing a dampness dispersing agent; an insulation adhesive laminating process (S2) for laminating an insulation adhesive (2) on a roll-formed conductor foil (1), while paying out the conductor foil (1); a first hardening process (S3) for heating the insulation adhesive (2) on the conductor foil (1) to form a complex (5) of the conductor foil (1) and a B-stage state insulation adhesion layer (2a); a metal-base material laminating process (S5) for attaining a laminate (7) by laminating a metal base material (6) on the B-stage state insulation adhesion layer (2a); and a second hardening process (S6) for changing the B-stage state insulation adhesion layer (2a) into a C-stage state insulation adhesion layer (2b), by heating and pressurizing the laminate (7) in a prescribed condition. Sheet-form cutting processes (S4, S15) for cutting the complex (5) or the laminate (7) into sheet-form can be executed, if necessary. |
