| 摘要 |
PURPOSE: A negative resist composition with the high heat resistance characteristic is provided to improve the productivity by omitting a chemical-vapor-deposition process and a subsequent etching process. CONSTITUTION: A negative resist composition includes 5-60 weight% of acrylic copolymer, 2-50 weight% of poly-functional monomer with ethylenically unsaturated bonds, 1-35 weight% of a photo-initiator, and 10-90 weight% of an organic solvent. The acrylic copolymer is obtained by copolymerizing unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, the mixture of the same, maleimide-based monomer, epoxy-based unsaturated monomer, silane-based unsaturated monomer, and monomer containing acrylic unsaturated compounds. The maleimide-based monomer is represented by chemical formula 1. In the chemical formula 1, R1 and R2 are respectively hydrogen or methyl group. The R3 is hydrogen, cyclohexyl group, naphthyl group, phenyl group, benzyl group, or C1 to C12 alkyl group. |
