| 摘要 |
PURPOSE: A wafer plating apparatus is provided to improve the filtration and distribution efficiency of metallic ion by including a filter filtering the metallic ions which is transferred by a vortex. CONSTITUTION: A reaction chamber(10) receives an electrolyte. A target(12) is dipped in the electrolyte and generates metallic ion when receiving a positive electrode. A plurality of swirl holes(22) through which the electrolyte is passed are formed on the target. A rotating unit(30) rotates a target. A filter(40) filters the metallic ion which is carried by vortex.
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