发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND PROGRAM FOR IMPLEMENTING THE METHOD
摘要 A substrate processing method which is capable of enhancing productivity in manufacturing product substrates. In process chambers of an etching apparatus, etching is carried out on a substrate as an object to be processed, and dummy processing is carried out on at least one non-product substrate before execution of the etching. A host computer determines whether or not the dummy processing is to be executed. The host computer determines whether or not the interior of each of the process chambers and is in a stable state, and omits the execution of the dummy processing when it is determined that it is in the stable state.
申请公布号 US2011139749(A1) 申请公布日期 2011.06.16
申请号 US201113034170 申请日期 2011.02.24
申请人 TOKYO ELECTRON LIMITED 发明人 YAMAZAKI SATOSHI;HASHIMOTO MITSURU
分类号 C23F1/00;C23C16/52;H01L21/00;H01L21/66 主分类号 C23F1/00
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