发明名称 LIGHT-EMITTING MODULE AND LIGHTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly reliable light-emitting module with good heat radiation. <P>SOLUTION: An LED chip 13 is mounted on a substrate 12 via a connecting member 14 essentially consisting of inorganic silver fine particles. The connecting member 14 having inorganic silver fine particles as a principal component efficiently transfers heat from the LED chip 13 to the substrate 12, thereby improving the heat radiation, and is hard to deteriorate, thereby keeping stable connecting strength. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011091213(A) 申请公布日期 2011.05.06
申请号 JP20090243707 申请日期 2009.10.22
申请人 TOSHIBA LIGHTING & TECHNOLOGY CORP 发明人 TAKEI HARUKI;KOYANAZU GO;KAWASHIMA KIYOKO
分类号 H01L33/64;F21S2/00;F21V29/00;F21Y101/02 主分类号 H01L33/64
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