发明名称 |
LIGHT-EMITTING MODULE AND LIGHTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable light-emitting module with good heat radiation. <P>SOLUTION: An LED chip 13 is mounted on a substrate 12 via a connecting member 14 essentially consisting of inorganic silver fine particles. The connecting member 14 having inorganic silver fine particles as a principal component efficiently transfers heat from the LED chip 13 to the substrate 12, thereby improving the heat radiation, and is hard to deteriorate, thereby keeping stable connecting strength. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011091213(A) |
申请公布日期 |
2011.05.06 |
申请号 |
JP20090243707 |
申请日期 |
2009.10.22 |
申请人 |
TOSHIBA LIGHTING & TECHNOLOGY CORP |
发明人 |
TAKEI HARUKI;KOYANAZU GO;KAWASHIMA KIYOKO |
分类号 |
H01L33/64;F21S2/00;F21V29/00;F21Y101/02 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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