| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board that satisfies both electric connection by conductive paste and physical connection by resin flow of an adhesive sheet when a wiring board provided with a plurality of connection terminals and wiring for connecting those connection terminals on one surface or both surfaces of a base is connected by an adhesive sheet having, at a predetermined position, a via filled with conductive paste containing at least conductive particles and a curable resin. SOLUTION: The wiring board is provided with the plurality of connection terminals and the wiring for connecting those connection terminals on one surface or both surfaces of the base, and an insulating resin composition layer is provided partially on at least one surface of the base, a wiring surface, and connection terminal surfaces, wherein a maximum thickness of the insulating resin composition layer provided to the connection terminal surfaces is≤6μm and a difference between a height of the insulating resin composition on the connection terminals and a height of the insulating resin composition on the base is≤5μm. COPYRIGHT: (C)2011,JPO&INPIT |
