MASK BLANK, METHOD FOR PRODUCING THE SAME, AND METHOD FOR MANUFACTURING TRANSFER MASK

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a mask blank for obtaining uniformity of desired film thickness in a plane of a resist film (≤100 Å) in a prescribed critical area, even when the critical area (substantial pattern forming area) for uniformity of film thickness in a plane of a resist film is enlarged.

SOLUTION: The method for producing the mask blank includes steps of dropping a resist solution 13 containing a resist material and a solvent onto a square substrate 2, rotating the substrate 2 to spread the dropped resist solution 13 over the substrate 2, and drying the resist solution 13 on the substrate 2 to form a resist coating film composed with the resist material on the substrate 2. While the substrate 2 is rotated in the step of forming the resist coating film, air is discharged by an air discharging means 18 to induce an airflow 19 along the upper face of the substrate 2 in a direction from the center to the outer circumference of the substrate 2 to suppress a liquid buildup of the resist solution 13 formed in a rim portion of the substrate from moving toward the substrate center by rotation of the substrate 2.

COPYRIGHT: (C)2011,JPO&INPIT