| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board that is superior in suppression of warpage of a substrate, performs processing while maintaining back-to-back manufacture of superior size stability and mass-productivity up to an outermost layer (a laminate surface by the back-to-back manufacture), and can secure higher size stability and operation efficiency. SOLUTION: The method of manufacturing the wiring board includes a step A of putting two substrates together back to back with each other into a first back-to-back substrate; a step B of forming wirings on both surfaces of the first back-to-back substrate; a step C of laminating two or more first back-to-back substrates; a step D of separating the substrates along surfaces put together back to back in the step A and forming a second back-to-back substrate having the two substrates turned over and put together back to back; a step E of forming wirings on both surfaces of the second back-to-back substrate; and a step F of separating the second back-to-back substrate along the surfaces put together back to back in the step D into the two substrates. COPYRIGHT: (C)2011,JPO&INPIT
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