发明名称 Nonvolatile memory devices and methods for fabricating nonvolatile memory devices
摘要 A nonvolatile memory device may include: a tunnel insulating layer on a semiconductor substrate; a charge storage layer on the tunnel insulating layer; a blocking insulating layer on the charge storage layer; and a control gate electrode on the blocking insulating layer. The tunnel insulating layer may include a first tunnel insulating layer and a second tunnel insulating layer. The first tunnel insulating layer and the second tunnel insulating layer may be sequentially stacked on the semiconductor substrate. The second tunnel insulating layer may have a larger band gap than the first tunnel insulating layer. A method for fabricating a nonvolatile memory device may include: forming a tunnel insulating layer on a semiconductor substrate; forming a charge storage layer on the tunnel insulating layer; forming a blocking insulating layer on the charge storage layer; and forming a control gate electrode on the blocking insulating layer.
申请公布号 US2009014781(A1) 申请公布日期 2009.01.15
申请号 US20080216945 申请日期 2008.07.14
申请人 BAIK SEUNG-JAE;KIM HONG-SUK;CHOI SI-YOUNG;HWANG KI-HYUN;HYUN SANG-JIN 发明人 BAIK SEUNG-JAE;KIM HONG-SUK;CHOI SI-YOUNG;HWANG KI-HYUN;HYUN SANG-JIN
分类号 H01L29/792;H01L21/28 主分类号 H01L29/792
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