| 发明名称 |
ADHESIVE TAPE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE |
| 摘要 |
Disclosed is an adhesive tape for electrically connecting conductive members to each other. The adhesive tape comprises a resin, a solder powder and a curing agent having a flux activity, wherein the solder powder and the curing agent are present in the resin. ® KIPO & WIPO 2009 |
| 申请公布号 |
KR20080109895(A) |
申请公布日期 |
2008.12.17 |
| 申请号 |
KR20087026595 |
申请日期 |
2008.10.30 |
| 申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
KATSURAYAMA SATORU;YAMASHIRO TOMOE;MIYAMOTO TETSUYA |
| 分类号 |
C09J7/02;C09J9/02;C09J163/02;H01L25/065 |
主分类号 |
C09J7/02 |
| 代理机构 |
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