| 摘要 |
<p>A method for manufacturing a stack package is provided to simplify a manufacturing process by eliminating a process for forming a seed layer and a metal layer in an inside of a via-hole. A wafer including a plurality of chips(200a,200b,200c) having via-holes at the same position and a printed circuit board(212) are prepared. The wafer is cut in the chip units. Two or more chips are stacked on the printed circuit board by using an adhesive so that the via-holes of each chip are aligned at the same position. Metal wires(222) are inserted into the via-holes of the stacked chips. The stacked chips are electrically connected to each other or the stacked chips are electrically connected to the printed circuit board by melting the metal wires. An upper surface of the printed circuit board including the stacked chips is sealed. A mounting member is attached to a lower surface of the printed circuit board.</p> |
