发明名称 COMPOSITE COPPER FOIL, MANUFACTURING METHOD THEREFORE, AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD USING COMPOSITE COPPER FOIL
摘要 PROBLEM TO BE SOLVED: To provide a composite copper foil that does not swell between a support metal foil and a thin copper layer when doing heat processing at high temperature, wherein after heat processing, the support metal foil gets easily separated from the thin copper layer. SOLUTION: The composite copper foil is composed of a metal foil used as a support, a peeling layer, and a thin copper layer, whose manufacturing method is such that during a lamination process using laminating rolls at a skin temperature of 400°C, in electrolyte composed of a composite copper foil that does not swell, a molybdenum compound, and a nickel compound, a layer composed of nickel, molybdenum, and oxygen is deposited through electrolysis on the metal foil used as the support, then, after a layer consisting mainly of molybdenum and oxygen is deposited by electrolysis using a lower current density compared with the above electrolytic condition, a peeling layer is once again formed by electrodepositing a layer of nickel and molybdenum, and then, the thin copper layer is electrodeposited and heat-treated at a temperature with≥100°C. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008130867(A) 申请公布日期 2008.06.05
申请号 JP20060315195 申请日期 2006.11.22
申请人 NIPPON DENKAI KK 发明人 SATO YUSHI
分类号 H05K1/09 主分类号 H05K1/09
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