METHOD FOR MACHINING NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING LIGHT EMISSION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for machining a nitride semiconductor substrate capable of securely machining grooves at a low cost in a nitride semiconductor substrate, and to provide a method for producing a light emission device.

SOLUTION: The method for machining a nitride semiconductor substrate comprises: a stage where a nitride semiconductor substrate is prepared; and a machining stage by a femtosecond laser. In the machining stage, the surface of a nitride semiconductor substrate is irradiated with a femto second laser, and a part of the surface of the nitride semiconductor substrate is removed, so as to form a recessed part on the surface. The energy fluence of the femtosecond laser used in the machining stage is 1×10-4to 5 J/cm2.

COPYRIGHT: (C)2007,JPO&INPIT