发明名称 Method of forming Polycrystalline Silicon type Thin Film Transistor
摘要 A method for manufacturing a polysilicon type thin film transistor comprises the steps of forming a polysilicon layer on a substrate, forming a gate insulating layer on the polysilicon layer, forming a gate layer on the gate insulating layer, forming a gate pattern by patterning, implanting impurities in the substrate over which the gate pattern is formed, forming a cover layer over the substrate in which impurities are implanted, and thermally annealing the substrate over which the cover layer is formed. In the invention, the thermal annealing is carried out instead of a costly laser annealing after the impurity implantation.
申请公布号 KR100737910(B1) 申请公布日期 2007.07.10
申请号 KR20000070976 申请日期 2000.11.27
申请人 发明人
分类号 G02F1/136;H01L21/28;H01L21/265;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/786 主分类号 G02F1/136
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