发明名称 |
Semiconductor device with improved design freedom of external terminal |
摘要 |
A semiconductor device comprises: a semiconductor chip having a first main surface, a second main surface, and a plurality of side surfaces; an extension portion which contacts and surrounds the side surfaces of the semiconductor chip; a base, which is capable of conducting heat generated by the semiconductor chip; an insulating film which is formed on the first face and the first main surface; a plurality of wiring patterns extended from electrode pads to the upper side of the first face of the extension portion; a sealing portion which is formed on the wiring patterns and insulating film; and a plurality of external terminals provided over the wiring patterns in a region including the upper side of the extension portion.
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申请公布号 |
US7151320(B2) |
申请公布日期 |
2006.12.19 |
申请号 |
US20030722446 |
申请日期 |
2003.11.28 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
SHIZUNO YOSHINORI |
分类号 |
H01L23/12;H01L23/28;H01L23/31;H01L23/433;H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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