| 摘要 |
PROBLEM TO BE SOLVED: To obtain a surface mounting semiconductor device such as a CSP in which a poor joint of the electrode portion of the semiconductor device and the connection pattern of a circuit board for mounting the semiconductor device can be specified. SOLUTION: The semiconductor device comprises a substantially planar semiconductor package portion 3, a plurality of electrode portions 5 arranged on one end face 3a in its thickness direction, at least one wiring unit 33 arranged in the semiconductor package portion 3 and interconnecting two adjacent electrode portions 5 electrically, and at least one external terminal 35 exposed outward from the surface of the semiconductor package portion 3 excepting the one end face 3a wherein the external terminal 35 is connected electrically with the wiring unit 33. COPYRIGHT: (C)2006,JPO&NCIPI |
